Product Overview
Kostat KS-882107 JEDEC Semiconductor Tray for VFBGA 8x11.5mm Packages - 228-Pocket Matrix, ESD-Safe Handling
Condition
Lot of 5, Used, in good condition. Photos show the specific unit you will receive. Molded markings confirm KOSTAT 8.0mm x 11.5mm VFBGA 12x19 KS-882107. All 228 pockets intact - no cracked pocket walls, broken dividers, or missing sections visible. Sourced from legacy electronics supply chain recovery.
Carefully packed and shipped same business day from our Idaho warehouse. Online since 1999. Honest equipment and straightforward service.
Backed by our guarantee. Serving customers since 1999.
Product Overview
Kostat KS-882107 is a JEDEC-standard semiconductor waffle tray for Very Fine Pitch Ball Grid Array (VFBGA) packages measuring 8.0mm x 11.5mm. The 12x19 cell matrix holds 228 components. Molded edge markings read KOSTAT 8.0mm x 11.5mm VFBGA 12x19 KS-882107 Rev. A - confirmed directly from product photos. Designed for ESD-safe storage, transport, and automated handling via pick-and-place machines, tray feeders, and inspection systems. JEDEC outline provides compatibility with standard automated semiconductor handling equipment.
Key Features
- Package type: VFBGA (Very Fine Pitch Ball Grid Array)
- Pocket dimensions: 8.0mm x 11.5mm - confirmed from molded tray markings
- Matrix: 12x19 cells, 228 total pockets
- JEDEC-standard outline for compatibility with automated handling equipment
- ESD-safe construction - antistatic material (specific grade not confirmed, verify against datasheet before use)
- Temperature rating: Not confirmed - verify against datasheet before use if baking or elevated-temperature processing is required
- Uniform gray waffle grid - all pocket walls intact per photo inspection
- Molded identification markings on tray edge: KOSTAT 8.0mm x 11.5mm VFBGA 12x19 KS-882107
Applications
- Storage and transport of VFBGA 8.0mm x 11.5mm ICs through supply chain and assembly stages
- Automated pick-and-place machine feeding for SMT assembly lines
- Component staging for semiconductor test and inspection systems
- Research lab and university semiconductor handling workflows
- OSAT facility component logistics for memory and mixed-package lines
Frequently Asked Questions
What package dimensions fit this tray?
The pocket size is 8.0mm x 11.5mm, confirmed from molded markings on the tray itself. This tray is designed for VFBGA packages matching those dimensions. Verify your component size against that pocket before ordering - even small dimensional differences can affect automated handling reliability.
Is this tray compatible with automated pick-and-place and tray feeder equipment?
Yes. This is a JEDEC-standard matrix tray, designed for use with JEDEC-compatible automated handling equipment including pick-and-place machines, tray feeders, and inspection systems. Confirm your equipment's JEDEC tray compatibility before integrating into an automated line.
Is this tray bakeable? What is the temperature rating?
Temperature rating is stamped as rated to 140 degrees Celsius - verify against the Kostat KS-882107 datasheet before use in any baking or elevated-temperature process. Using a non-bakeable tray for moisture-sensitive device baking would damage the tray and potentially the components.
What is the ESD rating of the tray material?
Kostat IC trays are generally antistatic or ESD-safe in construction, but the specific material grade and surface resistance value for the KS-882107 are not confirmed here. Verify against datasheet if your process requires a specific ESD classification.
What is included in this listing?
5 pieces, Kostat KS-882107 JEDEC waffle trays. No components, accessories, or documentation included.
The pockets are empty, the markings are clear, and 228 slots are ready for whatever VFBGA components you are moving through your line. Five trays = one clean start.
